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Teradek Bond II

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Price Pledge ensures we won't be beaten on price! We actively monitor the prices offered by our competitors daily and adjust our own pricing accordingly.

At a glance
Teradek TER-BOND2SDI (TERBOND2SDI) BOND II Integrated Camera-Top HDSDI Cellular Bonding Solution

Price Pledge

Price Pledge ensures we won't be beaten on price! We actively monitor the prices offered by our competitors daily and adjust our own pricing accordingly.

45569
Catalogue:
teradek_ter-bond2sdi / TER-BOND2SDI

Price Pledge

Price Pledge ensures we won't be beaten on price! We actively monitor the prices offered by our competitors daily and adjust our own pricing accordingly.


£3,864
€3,593.06

Price Pledge

Price Pledge ensures we won't be beaten on price! We actively monitor the prices offered by our competitors daily and adjust our own pricing accordingly. We pledge to match the price on most products offered by UK based dealers that are selling officially imported or manufactured UK stock, with full manufacturer warranty and is authorised to do so by the relevant manufacturer.

Please fill out the form below with the details of where you have found the cheaper item.

Terms and Conditions

Prior to the point of sale CVP will eneavour to match the price on most products subject (but not limited) to the following criteria:

  • The competitor must be UK based and an officially appointed dealer for the manufacturer of the goods in question.
  • Promotional offers aren't eligible for price matching and must be the price at which the product is normally sold at.
  • The competitor must have the goods in stock and available for purchase.
  • The competitors price can be verified in writing.
  • The goods and level of after sales support on offer must be identical (model number must be identical with identical warranty).
  • Competitors final cost including Postage and Packaging will be taken into account.
  • We do not price-match eBay, Amazon sellers, clearance stock or specialist retailers.
  • We cannot match bulk promotional offers such as buy one get one free.
  • The competitors price must be publically advertised online and cannot include any discounts.
  • No other promotional offers or vouchers can be used on top of the price match.

For further details please call us on 02083807400.

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Teradek TER-BOND2SDI (TERBOND2SDI) BOND II Integrated Camera-Top HDSDI Cellular Bonding Solution
Teradek Bond II
Quantity: 1
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Terms and conditions

The prices and shipping options are an estimate based on the purchase of a single item with nothing else in your basket. The prices and options below do not include shipping regulations and duties which will be checked in the checkout process.

At CVP we always strive to get your order to you as quickly as possible, but in the interest of clarity please note that next day is defined as the next working day (ie: excluding weekends, UK bank holidays and public holidays).

Orders placed and security cleared* before 14:00GMT where all items are in stock will normally** be dispatched on the same business day for ultimate delivery according to the shipping method selected.

Where an item is not physically in stock, the actual delivery time will be extended by the lead time for the product in question. Shipping to the Channel Islands, Northern Ireland, Republic of Ireland and some remote UK postcodes are not next day but 2 working days.

All transactions are subject to CVP security checks which are for our mutual protection against identity theft and fraud. In the event that additional checks are required you will be informed and dispatch time will be extended by the time taken to resolve any queries raised. We apologise for any inconvenience this may cause.

*Due to unforseen circumstances, on some occasions same day dispatch may not be possible. In this event we will always do our utmost to keep you fully informed of any delay imposed.

For more information on shipping, please read our Delivery and Collection or please our Terms and Conditions

Product Details

Overview
Bond II is an exciting addition to the award-winning Bond camera-top cellular mux family. Bond II was designed to function as an efficient and portable bonding solution that excels in time sensitive situations and challenging environments with minimal maneuverability. Its compact size, light weight, and low power consumption combined with its cost-effective price make Bond II an unbeatable value for broadcasters. Bond II comes with a built-in HD H.264 encoder, HD-SDI input, 6 USB slots for 3G/4G/LTE modems, and requires fewer cables than the original Cube + Bond system.
The Teradek Bond line of cellular bonding solutions allows video professionals to broadcast 1080p HD video over aggregated bandwidth from several network interfaces, including 3G/4G/LTE, WiFi, BGAN, Ethernet, and Fiber. Bond devices utilize hardware-based high profile H.264 compression, resulting  in very low power consumption and long run times. Each bonding solution offers a local monitoring capability on...
Included in box
  • 1x Teradek, Bond II 

About the Teradek Bond II

Bond II is an exciting addition to the award-winning Bond camera-top cellular mux family. Bond II was designed to function as an efficient and portable bonding solution that excels in time sensitive situations and challenging environments with minimal maneuverability. Its compact size, light weight, and low power consumption combined with its cost-effective price make Bond II an unbeatable value for broadcasters. Bond II comes with a built-in HD H.264 encoder, HD-SDI input, 6 USB slots for 3G/4G/LTE modems, and requires fewer cables than the original Cube + Bond system.

The Teradek Bond line of cellular bonding solutions allows video professionals to broadcast 1080p HD video over aggregated bandwidth from several network interfaces, including 3G/4G/LTE, WiFi, BGAN, Ethernet, and Fiber. Bond devices utilize hardware-based high profile H.264 compression, resulting  in very low power consumption and long run times. Each bonding solution offers a local monitoring capability on iOS devices, quick access to settings via an OLED display, and IFB for communication from the studio to the field. All Bond devices require a Sputnik server, which converts each bonded feed into a standard video format that can be sent to any streaming platform on the Web

Sputnik Server & Dashboard GUI
Sputnik is Teradek's free software application between Bond and your streaming destination. Sputnik is designed to run on a Linux computer either in the cloud using Amazon EC2) or on a local server with a single, publicly addressable  TCP port. The software recombines the packets from your cellular modems  into a cohesive stream that can be sent to an H.264 decoder or viewed online.
 
Core™
Sputnik also integrates with Core (coming soon), a new cloud-based encoder fleet management system. From an intuitive Web GUI, users are provided with extensive control over many parameters of connected Teradek IP video devices. Core also offers a unique drag and drop workflow that allows you to direct video feeds from any encoder to any number of decoders in real time.

List of Approved Modems
AT&T: USBConnect Momentum 4G (Sierra Wireless Aircard 313U) 
T-Mobile: Jet 2.0 (Huawei e366) 
Telstra: BigPond Ultimate (Sierra Wireless Aircard 312U) 
Telstra: BigPond 4G (Sierra Wireless Aircard 313U) 
Verizon: Pantech UML290 
Vodafone : K3805-Z, K5005 (Huawei e398)

VIDEO INPUT
HD-SDI, SD-SDI: BNC
SUPPORTED RESOLUTIONS
1080i 50/59.94/60
1080p 23.98/24/25/30
1080PsF 23.98/24/25
720p 50/59.94/60
576p (HDMI) / 576i (HD-SDI)
480p (HDMI) / 480i (HD-SDI)
VIDEO CODEC
Compression Algorithm: Baseline, Main and High Profile H.264
Main and Baseline profiles
Bit Rate: 250 Kbps to 10 Mbps
Built-in Video Scaler and Deinterlacer
VIDEO STREAMING SUPPORT
Network Protocols: TCP/IP, UDP, HTTP, DHCP, NTP, SSL, IGMP>
Transport Protocols: RTP, RTSP, RTP over HTTP, MPEG-TS**
RTMP (Adobe Flash Streaming)
HTTP Live Streaming
Point to Point (TCP or UDP), Multiple Unicast (UDP), or Multicast (UDP+IGMP)
AUDIO
Audio Compression: AAC-LC, MPEG Layer 2
Embedded Audio Input
Analog Line or Mic in, adjustable gain
Headphone output, adjustable volume
PHYSICAL
Dimensions: 2.5"W x 3.5"D x 1.5"H
Weight: 12oz
INTERFACES
Feature-rich WebUI for configuration and control
OLED LCD Display with joystick Navigation buttons
On/Off and Reset Switch
Micro SD
Six Powered USB 2.0 host ports
NETWORK
Ethernet: 10/100BASE-T
WiFi: Dual Band 802.11 a/b/g/n MiMO
Bonded USB Modem support
POWER
2 Pin Lemo Power input
Nominal Power Consumption: 3W + 2.5W (max) per USB device
Power Input: 6-28V DC
  • Six USB slots for 3G/4G/LTE modems, BGAN, Ethernet, WiFi
  • Modem mounting system
  • 250 Kbps to 10 Mbps
  • HD-SDI, SD-SDI: BNC input
  • Supports all standard resolutions and frame rates up to 1080p30.
  • IFB support

 

Compact & Affordable
The Bond II, is one of the smallest and most cost-effective cellular bonding solutions on the market today. Despite its industry leading design and features, the Bond II is very affordable, which opens the doors for anybody to go live from any location with adequate cellular coverage.

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